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BGA
Socket and Headers
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| We offer a full line of socketing products for Ball
Grid Array devices. Currently available is a socket and header for BGA devices on a .050
(1.27mm) spacing which provides the lowest insertion forces available on the market today.
The socket is designed to eliminate concerns with coplanarity and coefficient of expansion
issues. By addressing these two issues, the design of the socket reduces the stress placed
on solder joints during the soldering process, which reduces rework issues. Any size or
shape is available. Deliveries of this product are stock 1 week to 4 weeks. Specifications |
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Available Patterns |
| 16 x 16 Grid BGA Patterns |
156 Pin BGA
192 Pin BGA
255 Pin BGA
256 Pin BGA |
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| 17 X 17 Grid BGA Patterns |
208 Pin BGA |
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241 Pin BGA |
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| 18 X 18 Grid BGA Patterns |
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| 19 X 19 Grid BGA Patterns |
303 Pin BGA
308 Pin BGA
357 Pin BGA
360 Pin BGA |
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| 20 X 20 Grid BGA Patterns |
256 Pin BGA
272 Pin BGA
292 Pin BGA
324 Pin BGA |
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| 21 X 21 Grid BGA Patterns |
272 Pin BGA |
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| 22 X 22 Grid BGA Patterns |
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| 23 X 23 Grid Patterns |
304 Pin BGA
329 Pin BGA
421 Pin BGA |
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| 24 X 24 Grid Patterns |
432 Pin BGA |
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615 Pin BGA |
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| 25 X 25 Grid Patterns |
313 Pin BGA
474 Pin BGA |
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| 26 X 26 Grid Patterns |
388 Pin BGA |
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352 Pin BGA |
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492 Pin BGA |
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456 Pin BGA |
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356 Pin BGA |
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420 Pin BGA |
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256 Pin BGA |
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368 Pin BGA |
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| 27 X 27 Grid Patterns |
504 Pin BGA |
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503 Pin BGA |
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| 28 X 28 Grid Patterns |
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| 29 X 29 Grid Patterns |
480 Pin BGA |
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625 Pin BGA |
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649 Pin BGA |
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| 30 X 30 Grid Pattrens |
500 Pin BGA
596 Pin BGA |
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| 31 X 31 Grid Patterns |
432 Pin BGA |
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| 32 X 32Grid Patterns |
540 Pin BGA |
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| 33 X 33 Grid Patterns |
560 Pin BGA |
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| 34 X 34 Grid Patterns |
731 Pin BGA |
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| 35 X 35 Grid Patterns |
600 Pin BGA |
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652 Pin BGA |
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| 36 X 36 Grid Patterns |
720 Pin BGA |
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| 37 X 37 Grid Pattrens |
321 Pin BGA |
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| 43 X 43 Grid Patterns |
559 Pin BGA |
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Specifications |
Socket Contact: Three finger stamped
beryllium-copper allay 172 HT.
Plating: 10m" gold over 50m"
nickel.
Socket shell and Header pin: Precision machined brass alloy 360, 1/2
hard.
Plating: 10m" gold over 100m"
nickel.
Insulator Material: Glass-epoxy type FR-4 rated UL94V-0. TCE = 10 -
13ppm/ degrees C, er =5.0
Mechanical:
Insertion and withdrawal (using .018" dia polished steel pin gage):
Insertion: .2N max, .015N typ. Withdrawal: .05N min, .07n typ. Durability: 100 cycles,
coplanarity: <.005" |
Operating temperature range: -55 degrees C to +125 degrees C. The BGA
socket/header system have withstood the following environmental tests without mechanical
or electrical failure:
Damp heat, steady state: 40 degrees C, 93% rH, 21 days. Damp heat, cyclic: 25/55 degrees
C, 6days. Dry heat, 100 degrees C, 1000 hours. Thermal shock: -55 to +125 degrees, 5
cycles. Random vibration 50 to 500 Hz, 8g, 20 min. per axis. Shock: 50 g per axis.
Solderability: 235 degrees C, 2 seconds. Resistance to soldering heat: 270 degrees C, 10
seconds |
Electrical:
Current rating (per pin): 1 A
Working voltage: 100 V RMS/150 V DC
max.
Low level contact resistance: 10 mW max. Insulation resistance
@ 500 V RMS: Initial value: 1,000,000 MW
min., after climatic test: 10,000 MW min. Dielectric
withstanding voltage: 500 V RMS. Capacitance between
adjacent contacts: 1pF max. Self inductance per pin: 2nH max. Electric length: 31pS. |
Resistance to corrosions:
Salt spray: 48 hours. Sulfur dioxide: 96 hours @ 25 ppm SO2 , 25 degrees C,
75% rH. Hydrogen sulfide: 96 hours @ 12ppm H2S, 25 degrees C, 75% rH. |
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