|
| |
Why
Use a BGA Socket and Header on your PCB?
|
Currently available is a socket and header for BGA devices on .050
(1.27mm) and .0393 (1.0mm) spacing which provides the lowest insertion forces available on
the market today. Sockets and headers for BGA:s are manufactured using reliable screw
machine sockets. This socket is surface mountable to existing BGA foot prints and is
available in any size or shape to the many foot print patterns for BGA!s. The socket can
be manufactured to accommodate the mounting of heat sinks, and the header is manufactured
in a open or closed frame configuration to allow for programming of devices.
Today's end users are concerned with the coplanarity of most surface mountable components.
Will the part solder to the board and not be squewed or bowed causing the ASIC device to
have undesired stress when placed into position, and are all of the positions soldered
properly to the board?
Coefficient of expansion mismatch between the BGA socket and the mother board which it
will be mounted to are reduced significantly. The design of the socket carrier eliminates
the stress placed on the solder joints of the interconnect pins during the soldering
process, eliminating fracturing of the solder joints at each pin position. Conventional
surface mount sockets may have bowing of the carrier causing stress on the solder joints
of each pin. Adapter Technologies carrier allows each pin to have its own identity to the
board it is mounted to. After soldering, each pin is perfectly parallel to the mating
board surface which assist in the lowering of insertion forces when having a high pin
count on either.0393 (1.0mm) or .050 (1.27mm) spacing. |
 |
|
