1.0 mm BGA Sockets and Headers



HOME	CATALOG	CONTACTS	COMPANY	PRESS RELEASE	DIRECTIONS

Products and Services
*Why Go with a BGA Socket and Header?*
*1.27 mm (0.050) BGA Socket Products*
*1.0 mm (.03937) BGA Socket Products*
*PCB, BGA/u'BGA/CSP Rework / Reball Services*
*PCB, BGA /u'BGA/CSP Placement Services*
*BGA Device Converters*
*BGA x-ray Services*
Custom Application Adapters
Application Specific Modules
Direct Device Replacement Modules
*Development Tools*
*Test / Burn-In Sockets*
Engineer/Prototype PCB Assemblies
*PCB Assembly Services*
*PCB Turnkey Assembly*
PCB Design Services BGA 1.00 / 1.27mm
Custom Screw Machine Pins
Wirewrap Board Assemblies
*Chassis System Assembly*
*PLCC Sockets*

1.0 mm BGA Socket and Headers

1mm324.jpg (129845 bytes)

We offer a full line of socketing products for 1.0 mm Ball Grid Array devices. Currently available is a socket and header for BGA devices on a .0393 (1.00mm) spacing which provides the lowest insertion forces available on the market today. The socket is designed to eliminate concerns with coplanarity and coefficient of expansion issues. By addressing these two issues, the design of the socket reduces the stress placed on solder joints during the soldering process, which reduces rework issues. Specifications

Available Patterns
10 x 10 Grid BGA Patterns	100 Pin BGA

14 X 14 Grid BGA Patterns	156 Pin BGA
	160 Pin BGA
	196 Pin BGA

15 X 15 Grig BGA Patterns	225 Pin BGA

16 X 16 Grid BGA Patterns	256 Pin BGA

18 X 18 Grid BGA Patterns	239 Pin BGA
	324 Pin BGA

22 X 22 Grid BGA Patterns	324 Pin BGA
	484 Pin BGA
	360 Pin BGA
	456 Pin BGA

26 X 26 Grid BGA Patterns	676 Pin BGA

30 X 30 Grid BGA Patterns	324 Pin BGA
	416 Pin BGA
	900 Pin BGA

32 X 32 Grid BGA Patterns	1020 Pin BGA

34 X 34 Grid BGA Patterns	680 Pin BGA
	700 Pin BGA
	1152 Pin BGA
	1156 Pin BGA

38 X 38 Grid BGA Patterns	956 Pin BGA

39 X 39 Grid BGA Patterns	680 Pin BGA

42 X 42 Grid BGA Patterns	860 Pin BGA

Specifications
Socket Contact: Three finger stamped beryllium-copper allay 172 HT. Plating: 10m" gold over 50m" nickel. Socket shell and Header pin: Precision machined brass alloy 360, 1/2 hard. Plating: 10m" gold over 100m" nickel. Insulator Material: Glass-epoxy type FR-4 rated UL94V-0. TCE = 10 - 13ppm/ degrees C, er =5.0 Mechanical: Insertion and withdrawal (using .018" dia polished steel pin gage): Insertion: .2N max, .015N typ. Withdrawal: .05N min, .07n typ. Durability: 100 cycles, coplanarity: <.005"	Operating temperature range: -55 degrees C to +125 degrees C. The BGA socket/header system have withstood the following environmental tests without mechanical or electrical failure: Damp heat, steady state: 40 degrees C, 93% rH, 21 days. Damp heat, cyclic: 25/55 degrees C, 6days. Dry heat, 100 degrees C, 1000 hours. Thermal shock: -55 to +125 degrees, 5 cycles. Random vibration 50 to 500 Hz, 8g, 20 min. per axis. Shock: 50 g per axis. Solderability: 235 degrees C, 2 seconds. Resistance to soldering heat: 270 degrees C, 10 seconds
Electrical: Current rating (per pin): 1 A Working voltage: 100 V RMS/150 V DC max. Low level contact resistance: 10 mW max. Insulation resistance @ 500 V RMS: Initial value: 1,000,000 MW min., after climatic test: 10,000 MW min. Dielectric withstanding voltage: 500 V RMS. Capacitance between adjacent contacts: 1pF max. Self inductance per pin: 2nH max. Electric length: 31pS.	Resistance to corrosions: Salt spray: 48 hours. Sulfur dioxide: 96 hours @ 25 ppm SO2 , 25 degrees C, 75% rH. Hydrogen sulfide: 96 hours @ 12ppm H2S, 25 degrees C, 75% rH.